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Product List

721.

Efficiency Laser Trimming Equipment for Rapid Mass Production of Various Specifications of Chip ...

Open Details in New Window [Apr 30, 2024]

Product Description Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

722.

Self-Developed Tgv High Yield Precision Cutting Laser Drilling Equipment with Good Stability

Open Details in New Window [Apr 30, 2024]

Product Description Suitable for processing brittle materials; Laser dual station precision cutting, with good stability and high yield; Having a high-precision visual ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

723.

6 Inch 8 Inch Sic Laser Annealing Equipment with Fully Autonomous Optical System

Open Details in New Window [Apr 28, 2024]

Product Description Product Features First domestic green laser machine for mass pruduction High reliability and stability Independly developped Optical system, LIET technology ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

724.

Top Quality Escalator Indoor/Outdoor Escalator Angle 30/35 Speed 0.5m/S The Supermarket Equipment ...

Open Details in New Window [May 17, 2024]

Safety Standard Escalator Description: Cheap OEM Passenger Elevator with European ...

Company: Suzhou Dazen Electromechanical Technology Co., Ltd.

725.

Energy Saving Escalator The Indoor Escalator Angle 30/35 Speed 0.5m/S The Supermarket Equipment ...

Open Details in New Window [May 17, 2024]

Safety Standard Escalator Description: Cheap OEM Passenger Elevator with European ...

Company: Suzhou Dazen Electromechanical Technology Co., Ltd.

726.

B300 Doped Poly Si Batch Wafers Semiconductor Equipment for Doped Ploy Si in DRAM

Open Details in New Window [Apr 26, 2024]

Product Description Exhibition & Customers Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

727.

Good Cutting Quality High Precision Laser Cutting Equipment for Slicing/Cutting /Drilling of ...

Open Details in New Window [Apr 26, 2024]

Product Description Product overview: mps-0303lp fiber laser cutting machine adopts high-performance linear motor, high-resolution grating ruler, fixed gantry marble platform ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

728.

Auto-Theta Alignment Water System Da1201 IC Linear High Precision Die Attach Semiconductor Equipment

Open Details in New Window [Apr 26, 2024]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

729.

High Speed Precision Automatic Semiconductor Equipment for IC Package Wafer Die Bond Die Bonding ...

Open Details in New Window [Apr 26, 2024]

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

730.

Semiconductor Strippers Equipment with Double Switch Protection/Emergency Stop Button Device

Open Details in New Window [Apr 17, 2024]

Product Description features Automatic glue removeralso known as Flush runner residual glue machine and semiconductor strippers; 1. Equipment function: one-time punching (removal) ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

731.

High Precision and Stable Performance Automatic Glue Remover Seminconductor Equipment

Open Details in New Window [Apr 17, 2024]

Product Description features Automatic glue removeralso known asFlush runner residual glue machineand semiconductor strippers; 1. Equipment function: one-time punching (removal) ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

732.

High Accuracy Automatic Chip Laying Equipment for Manufacturing and Testing

Open Details in New Window [Apr 17, 2024]

Product Description Main Features Equipment function: Using a robotic arm to automatically grasp and discharge the lead frame; Applicable packaging: all packaging; Control ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

733.

Trim & Form System Semiconductor Equipment for Product Cutting/ Bending/Forming/Separation After ...

Open Details in New Window [Apr 17, 2024]

Product Description Main Features Equipment function: product cutting, bending, forming, and separation after plastic sealing; Applicable packaging: SOP/SSOP and other ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

734.

Semiconductor Auto Molding Equipment with Servo Control System, PLC (Omron) +Controller

Open Details in New Window [Apr 17, 2024]

Product Description Characteristic Fully automatic plastic packaging system, also known as fully automatic packaging system; Servo control system, PLC (Omron)+controller; WIN10+15 ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

735.

Non Damaging Vertical Microwave Plasma Cleaning Equipment Controlled by Touch Screen PLC

Open Details in New Window [Apr 16, 2024]

Product Description Vacuum microwave plasma cleaning machine MWD80 Vertical cabinet microwave plasma cleaning machine, controlled by touch screen PLC or industrial computer, can ...

Company: Jiangsu Himalaya Semiconductor Co., Ltd.

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