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Pulse Type Handheld Laser to Remove Oxidation Layer and Paint Layer of Hand-Held Laser Cleaning ...
[May 17, 2024]
Product Description 200W Laser Descaling Machine:CL-H-200W The whole machine is simple to operate. Just connect the power, then it can start to clean without chemical reagent, ...
Company: Suzhou Chirui Mechanical and Electrical Technology Co., Ltd.
High End Die Attach Bonder Equipment to Assist in Semiconductor Packaging
[Apr 30, 2024]
Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to ...
High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment
[Apr 30, 2024]
Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to ...
Multi-Axis Automatic Dispenser Hot Melt Adhesive, Sealing, Silicone Dispensing Equipment
[Apr 30, 2024]
Product Description Standard Features Computer Control, Windows OS CCD visual positioning system Servo Motor UPS and voltage stabilizer ESD grounding point- CE certifed ...
Fully Automatic Double Dispensing High Speed Die Bonder Semiconductor Bonding Equipment
[Apr 28, 2024]
Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision ...
High Precision Wafer Die Bonder Dispensing Equipment for Semiconductor Packaging Solutions
[Apr 28, 2024]
Product Description Equipment Specifications DIE BONDER SHD8120S Loading method Wafer stacking and tray Frame size L:110-300mm W:12-100mm H:0.1-1mm Chip ...
High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System
[Apr 28, 2024]
Product Description Equipment Specifications DIE BONDER SHD8060 Bonding method Eutectic Bonding precision X/Y ±0.04mm Bonding speed (UPH) 20K(Chip size ...
Fully Automatic Semiconductor High-Precision Die Attch Provide Flexible Packaging Equipment
[Apr 28, 2024]
Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm ...
Wafer Mounter Photonics Packaging Eutectic Bonding Machine Die Attach Equipment
[Apr 28, 2024]
Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm ...
China Factory Chip Testing and Detection Wafer Bonder Semiconductor Sorting Equipment
[Apr 28, 2024]
Product Description Equipment Specifications PIaK PLACE HANDLER SHF9000 Test station 1/2/4/8 site Nozzle module 1×4 mode Test mode Room temperature ...
Automatic Die Bonder Qfn Dfn Upload and Down Load Semiconductor Equipment
[Apr 28, 2024]
Product Description Equipment Specifications TURRET HANDLER SHF8000 Package SOD-123,SOT-23,SOT-26,SOP-8,SOT-89,SOT-223,QFN,DFN UPH 35000-50000PCS Feeding Bowl feeder Test ...
PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
[Apr 26, 2024]
Product Description Product Features Automatic recognition of front-end process marks. Direct access to Mapping files for laser marking Line scan CCD detection and identification ...
Pss-H160 Parallel Seam Welding Machine Semi-Automatic Equipment
[Apr 26, 2024]
Product Description PSS-H160 parallel seam welding machine is a semi-automatic equipment. This device can be used for metal bases and covers Airtight packaging between. This ...
Koosen 8t Qdd80 Heavy Duty Truck Towing Equipment Tugger
[Apr 22, 2024]
Product Description Koosen Electric Tugger have wide range from 2000kg to 15000kg towing capacity, Which can offers an assortment of industrial electric tuggers to meet your ...
Company: Suzhou Koosen Technology Co., Ltd.
Full Automatic PVC Pipe Belling Machine Plastic Tube Expanding Equipment
[May 11, 2024]
Full Automatic PVC Pipe Belling Machine Plastic Tube Expanding Equipment Product Description It used for belling of PVC pipes with ODΦ 200-500mm. The pipe belling type: ...
